Method of making emitter trench BiCMOS using integrated dual lay

Fishing – trapping – and vermin destroying

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

437203, 148DIG10, 148DIG11, 257565, 257587, H01L 21265

Patent

active

054880033

ABSTRACT:
A new method of isolating a polysilicon emitter from the base region of a bipolar transistor, trenching the polysilicon emitter into the semiconductor substrate, and maintaining a consistent base width of a bipolar transistor independent of variations in emitter mask thicknesses is disclosed. The polysilicon emitter isolation provides for better electrical breakdown characteristics between the emitter and the base by protecting the dielectric layer between the polysilicon emitter and base regions from defects and contamination associated with the BiCMOS manufacturing environment. The polysilicon emitter is trenched into the semiconductor substrate in order to reduce transistor operation problems associated with hot electron injection. Consistent base widths improve transistor performance uniformity thereby improving manufacturability and reliability.

REFERENCES:
patent: 4435898 (1984-03-01), Gaur et al.
patent: 5132234 (1992-07-01), Kim et al.
patent: 5192992 (1993-03-01), Kim et al.
patent: 5196356 (1993-03-01), Won et al.
patent: 5198372 (1993-03-01), Verret
patent: 5204277 (1993-04-01), Somero et al.
patent: 5213989 (1993-05-01), Fitch et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method of making emitter trench BiCMOS using integrated dual lay does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of making emitter trench BiCMOS using integrated dual lay, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of making emitter trench BiCMOS using integrated dual lay will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-156437

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.