Metal working – Method of mechanical manufacture – Electrical device making
Patent
1992-04-24
1993-10-05
Arbes, Carl J.
Metal working
Method of mechanical manufacture
Electrical device making
437220, H01R 4300
Patent
active
052493547
ABSTRACT:
A method of making a semiconductor integrated circuit package (20) containing a chip (25)--and/or other active or passive electronic component(s)--enclosed in an encapsulation layer (24) can be made thinner by abandoning the limitation of equality of thicknesses of electrically conductive lead frame fingers (21) and paddle (mounting pad, 22)--the latter of which supports the chip (25) during fabrication of the package prior to encapsulation. As a result, a desired downset d of the paddle (22) with respect to inner portions (21.1) of the conductive fingers (21) automatically occurs without any bending of any die paddle support fingers--the latter of which support the paddle during fabrication of the package. The paddle (22) advantageously is made by preparing a metallic pad sheet having a thickness equal to that of the paddle (22), and then dividing it into a multiplicity of pieces, each of the pieces having a contour such that the piece is suitable for use as the paddle (22).
REFERENCES:
patent: 4079511 (1978-03-01), Grabbe
patent: 4774635 (1988-09-01), Greenberg et al.
patent: 4801765 (1989-01-01), Moyer et al.
patent: 5014113 (1991-05-01), Casto
IBM Technical Disclosure Bulletin, vol. 29, No. 6, Nov. 1986, pp. 2486-2487.
American Telephone & Telegraph Co.
Arbes Carl J.
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