Method of making electronic chip with metalized back including a

Details Method of making electronic chip with metalized back including a Method of making electronic chip with metalized back including a

1982-04-12

1984-06-05

Hearn, Brian E.

Metal working

Method of mechanical manufacture

Assembling or joining

29576S, 29590, 29591, 357 71, 427 89, 428642, 428643, 428656, 428661, 428673, 428680, H01L 2192

Patent

active

044519729

ABSTRACT:
Electronic chip having a composite stratified metal back and method of making it in which strata of metal and/or metal alloys are deposited on the back of the silicon base or a wafer carrying a plurality of circuit components on its face at least one of the strata being resistant to passage of copper at attaching and operational temperatures, and a stratum of solder is provided on the surface of the previously deposited strata for joining the chip to a lead frame.

REFERENCES:
patent: 3046176 (1962-07-01), Bosenberg
patent: 4321617 (1982-03-01), Duda et al.
patent: 4360142 (1982-11-01), Carpenter et al.

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