Method of making constant clearance flat link fine wire intercon

Details Method of making constant clearance flat link fine wire intercon Method of making constant clearance flat link fine wire intercon

1992-06-05

1993-04-27

Heinrich, Samuel M.

Metal fusion bonding

Process

With condition responsive, program, or timing control

228179, H01L 2160, H05K 332

Patent

active

052054632

ABSTRACT:
A method of pre-forming a length of fine wire while simultaneously making a fire wire interconnection between a first and a second bonding point on a semiconductor device includes the steps of teaching the location of the edges of the die and teaching a plane in space which is located away from the edges of said die. After teaching the height of the clearance above the die and the XYZ location of the first and second bonding points the automatic wire bonder in directed to generate a desired geometric link profile between bonding points which defines the length of links L1, L2 and L3. Using the geometric profile and empirically determined constants the automatic wire bonder calculates a tool trajectory for pre-forming the fine wire while simultaneously making a fine wire interconnection with an automatic wire bonder.

REFERENCES:
patent: 4068371 (1978-01-01), Miller
patent: 4327860 (1982-05-01), Kirshenboin et al.
patent: 4445633 (1984-05-01), Bonham, Jr.
Japanese Publication No. 3-142941 dated Jun. 18, 1991 corresponding to Appln. Ser. No. 1-283335 filed Oct. 30, 1989 by Messers Hiroki and Kawabata; Assigned to Mitubishi Electric Ltd.

Affiliated with

Also associated with

Rating

Method of making constant clearance flat link fine wire intercon does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of making constant clearance flat link fine wire intercon, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of making constant clearance flat link fine wire intercon will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2321274