Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate
2008-06-10
2008-06-10
Tugbang, A. Dexter (Department: 3729)
Metal working
Method of mechanical manufacture
Electrical device making
C029S830000, C029S847000, C216S038000, C216S105000, C428S624000, C428S687000, C428S901000
Reexamination Certificate
active
07383629
ABSTRACT:
A circuitized substrate in which two conductive layers (e.g., electroplated copper foil) are bonded (e.g., laminated) to an interim dielectric layer. Each of the two foil surfaces which physically bond to the dielectric are smooth (e.g., preferably by chemical processing) and include a thin, organic layer thereon, while the outer surfaces of both foils are also smooth (e.g., preferably also using a chemical processing step). One of these resulting conductive layers may function as a ground or voltage plane while the other may function as a signal plane with a plurality of individual signal lines as part thereof. An electrical assembly and an information handling system utilizing such a circuitized substrate are also provided, as is a method of making the substrate.
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BondFilm (TM) The Functional Alternative for Inner Layer Bonding, www.insulectro.com/BondFilm.pdf.
Atotech, Feb. 27, 2004, http://web.archive.org/web/20040227192435/www.insulectro.com/PCB—Chem.htm.
Lauffer John M.
Markovich Voya R.
Wozniak Michael
Cazan Livius R
Endicott Interconnect Technologies, Inc.
Fraley Lawrence R.
Hinman, Howard & Kattell LLP
Levy Mark
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