Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board
Reexamination Certificate
2011-03-22
2011-03-22
Talbot, Brian K (Department: 1715)
Coating processes
Electrical product produced
Integrated circuit, printed circuit, or circuit board
C427S096100, C427S097100, C427S098400
Reexamination Certificate
active
07910156
ABSTRACT:
A method of making a circuitized substrate in which conductors are formed in such a manner that selected ones of the conductors include solder while others do not and are thus adapted for receiving a different form of connection (e.g., wire-bond) than the solder covered conductors. In one embodiment, the solder may be applied in molten form by immersing the substrate within a bath of the solder while in another the solder may be deposited using a screening procedure.
REFERENCES:
patent: 4702792 (1987-10-01), Chow et al.
patent: 4775611 (1988-10-01), Sullivan
patent: 5084071 (1992-01-01), Nenadic et al.
patent: 5118385 (1992-06-01), Kumar et al.
patent: 5134056 (1992-07-01), Schmidt et al.
patent: 5160579 (1992-11-01), Larson
patent: 5308796 (1994-05-01), Feldman et al.
patent: 5309632 (1994-05-01), Takahashi et al.
patent: 5338645 (1994-08-01), Henderson et al.
patent: 5358622 (1994-10-01), Korsten
patent: 5468409 (1995-11-01), Dull
patent: 5494781 (1996-02-01), Ohtani et al.
patent: 5502893 (1996-04-01), Endoh et al.
patent: 6547974 (2003-04-01), Albrechta et al.
patent: 7087441 (2006-08-01), Konrad et al.
patent: 7169313 (2007-01-01), Card et al.
patent: 2002/0152925 (2002-10-01), Soutar et al.
patent: 2087157 (1982-05-01), None
Card Norman A.
Harendza Robert J.
Konrad John J.
Mosher Tonya L.
Pitely Susan
Endicott Interconnect Technologies, Inc.
Fraley Lawrence R.
Hinman, Howard & Kattell
Levy Mark
Talbot Brian K
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