Fishing – trapping – and vermin destroying
Patent
1995-06-27
1997-02-04
Picardat, Kevin
Fishing, trapping, and vermin destroying
437211, 437214, 437217, 437219, H01L 2160
Patent
active
055997473
ABSTRACT:
A method of making a circuitized substrate which may be utilized as a chip carrier structure. The method involves the steps of providing a dielectric member and partially routing this member to define a temporary support portion therein. Metallization and circuitization may then occur, following which the temporary support portion is removed. This temporary support thus assures effective support for the photoresist used as part of the circuitization process. Thus, the photoresist is capable of being applied in sheetlike form for spanning the relatively small openings of the dielectric without sagging, bowing, etc., which may adversely impact subsequent processing steps.
REFERENCES:
patent: 4773955 (1988-09-01), Mabuchi et al.
patent: 5048179 (1991-09-01), Shindo et al.
patent: 5102829 (1992-04-01), Cohn
patent: 5175060 (1992-12-01), Enomoto et al.
patent: 5285352 (1994-02-01), Pastore et al.
patent: 5397917 (1995-03-01), Ommen et al.
Bhatt Ashwinkumar C.
Duffy Thomas P.
Houser David E.
Jones Gerald W.
McKeveny Jeffrey
Fraley Lawrence R.
International Business Machines - Corporation
Picardat Kevin
LandOfFree
Method of making circuitized substrate does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method of making circuitized substrate, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of making circuitized substrate will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-678193