Method of making circuit boards with locally enhanced wiring den

Details Method of making circuit boards with locally enhanced wiring den Method of making circuit boards with locally enhanced wiring den

1995-01-10

1996-12-10

Caldapola, Glenn

Etching a substrate: processes

Forming or treating electrical conductor article

Forming or treating of groove or through hole

216 20, 430312, 430313, 430314, 430317, 430318, 430319, G03C 500

Patent

active

055827454

ABSTRACT:
A printed circuit board and a method for making same is disclosed whereby a very high wiring density is provided in those regions of the printed circuit board in which external components (e.g., semiconductor chips) are to be attached directly. An automated registration routine permits very precise registration and positioning in said regions.

REFERENCES:
patent: 4211603 (1980-07-01), Reed
patent: 4897338 (1990-01-01), Spicciati et al.
patent: 5110664 (1992-05-01), Nakanishi et al.
patent: 5200300 (1993-04-01), Leibovitz et al.
patent: 5272645 (1993-12-01), Kawakami et al.
patent: 5387495 (1995-02-01), Lee et al.

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