Method of making circuit assembly with hardened direct bond lead

Details Method of making circuit assembly with hardened direct bond lead Method of making circuit assembly with hardened direct bond lead

1987-11-13

1988-12-06

Arbes, Carl J.

Metal working

Method of mechanical manufacture

Electrical device making

174 522, 174 524, 357 70, H01R 4300

Patent

active

047887656

ABSTRACT:
In an electric circuit assembly (2) having conductive lead frames (8-10) directly bonded to an insulating substrate (6) by a eutectic, the lead frames are further subjected to a work hardening step (32, 34) to stiffen the lead frames and enable push-on fastener connection (12) to the lead frames without collapse thereof.

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"Over 50 Years of Experience With the Direct Bond Copper Process", Tegmen Corp., 1201 East Fayette Street, Syracuse, N.Y.

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