Method of making ceramic substrate

Metal working – Method of mechanical manufacture – Electrical device making

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Details

29830, 156 8911, 156 8912, 156 8916, 156 8917, 174257, H01R 310

Patent

active

060414960

ABSTRACT:
The present invention relates to multi-layer ceramic packaging of hybrid micro-electronic devices, including those for implantable medical devices. The invention permits size reduction and design simplification in such packaging by eliminating the need for electrolytic or electroless plating, and by eliminating or substantially eliminating the shrinkage variation typically associated with surface metallization techniques.

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