Method of making ceramic microwave electronic package

Details Method of making ceramic microwave electronic package Method of making ceramic microwave electronic package

1994-04-22

1995-09-12

Arbes, Carl J.

Metal working

Method of mechanical manufacture

Electrical device making

29827, 156 89, 264 61, H05K 1300

Patent

active

054488265

ABSTRACT:
A ceramic microelectronic package suitable for high-frequency microelectronic devices includes a base which is at least partially conductive attached either by seal glass or by solder to a ceramic RF substrate with a cavity formed at its center and a pattern of conductive paths for providing interconnection from the inside to the outside of the package. The base may be metal or ceramic with a metal layer deposited thereon. A ceramic seal ring with a second cavity corresponding to that of the RF substrate, but slightly larger, is attached to the RF substrate by seal glass which is patterned to generally match the dimensions of the seal ring. A ceramic lid is attached to the top of the seal ring by a non-conductive adhesive, such as a polymer adhesive or low temperature seal glass, to seal the package once the microelectronic device has been mounted inside.

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