Method of making ceramic lid assembly for hermetic sealing of a

Details Method of making ceramic lid assembly for hermetic sealing of a Method of making ceramic lid assembly for hermetic sealing of a

1981-02-17

1982-10-26

Weston, Caleb

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

29588, 220200, B32B 3126, C04B 3912

Patent

active

043560474

ABSTRACT:
A ceramic lid assembly includes an integral heat fusible layer defining a hermetic sealing area provided around the periphery of a ceramic lid for hermetic sealing semiconductor chips in a flat pack. The integral heat fusible layer includes a metallized layer, an oxidation inhibiting layer, and a preflowed solderable layer in registration with each other in the hermetic sealing area.

REFERENCES:
patent: 3032869 (1962-05-01), Hochman
patent: 3189504 (1965-06-01), Whittle et al.
patent: 3281931 (1966-11-01), Ritz
patent: 3284891 (1966-11-01), Whitney
patent: 3308525 (1967-03-01), Tsuji et al.
patent: 3341649 (1967-09-01), James

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