Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Reexamination Certificate
2007-06-19
2007-06-19
Thai, Luan (Department: 2891)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Metallic housing or support
C438S121000, C257S714000, C257S715000, C257S716000
Reexamination Certificate
active
11119328
ABSTRACT:
A cascaded die mounting device and method using spring contacts for die attachment, with or without metallic bonds between the contacts and the dies, is disclosed. One embodiment is for the direct refrigerant cooling of an inverter/converter carrying higher power levels than most of the low power circuits previously taught, and does not require using a heat sink.
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Adams Donald J.
Ayers Curtis W.
Coomer Chester
Hsu John S.
Marlino Laura D.
Thai Luan
UT-Battelle LLC
Wilson Kirk A.
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