Metal working – Method of mechanical manufacture – Providing transitory integral holding or handling portion
Patent
1995-11-30
1998-06-09
Bryant, David P.
Metal working
Method of mechanical manufacture
Providing transitory integral holding or handling portion
29558, 425463, 425464, 228161, B23P 1700
Patent
active
057617872
ABSTRACT:
A honeycomb extrusion die and a method of making the die are disclosed, the die being made by bonding a die discharge section formed as a separate pin array to a separate die body incorporating an array of feed channels, the pin array comprising a plurality of pins attached to and extending outwardly from a body-compatible pin support which is removed after bonding the pins to the body. The pins may be formed of hard wear materials, and may have any of a variety of cross-sectional shapes adapted to improve extrusion uniformity as well as to form honeycomb cells of a variety of different cross-sectional shapes.
REFERENCES:
patent: 3678570 (1972-07-01), Paulonis et al.
patent: 3790654 (1974-02-01), Bagley
patent: 3846197 (1974-11-01), Wiley
patent: 4041597 (1977-08-01), Folmar et al.
patent: 4354820 (1982-10-01), Yamamoto et al.
patent: 4486934 (1984-12-01), Reed
patent: 4640454 (1987-02-01), Yamamoto et al.
patent: 4653996 (1987-03-01), Ozaki et al.
patent: 4780075 (1988-10-01), Ozaki et al.
patent: 4820146 (1989-04-01), Inoue et al.
patent: 4830598 (1989-05-01), Inoue et al.
patent: 4875264 (1989-10-01), Inoue et al.
patent: 4984487 (1991-01-01), Beckmeyer
patent: 5702659 (1997-12-01), Kragle et al.
Kragle Harry A.
Stumpff Floyd E.
Bryant David P.
Corning Incorporated
VAN DER Sterre Kees
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