Method of making backside illuminated image sensors

Details Method of making backside illuminated image sensors Method of making backside illuminated image sensors

1992-08-03

1993-09-14

Hearn, Brian E.

Fishing, trapping, and vermin destroying

437 53, 437236, 437974, 148DIG12, 148DIG135, H01L 3118

Patent

active

052448177

ABSTRACT:
A method of making a backside illuminated image includes forming a device on the frontside of thin device layer provided on an oxide layer which is mounted on a sacrificial substrate and bonding the front side of the device layer to a permanent silicon support substrate. Thereafter, the oxide layer and sacrificial layer are removed by chemical etching to expose the backside of the thin device layer.

REFERENCES:
patent: 3922705 (1975-11-01), Yerman
patent: 4266334 (1981-05-01), Edwards et al.
patent: 4317125 (1982-02-01), Hughes et al.
patent: 4321747 (1982-03-01), Takemura et al.
patent: 4771016 (1988-09-01), Bajor et al.
patent: 4946716 (1990-08-01), Corrie
patent: 5013681 (1991-05-01), Godbey et al.
patent: 5110748 (1992-05-01), Sarma
Blouke et al, Large Format, High Resolution Image Sensors, Optical Engineering, vol. 26, No. 9, 837 (1987).
Huang et al, A Wafer-Scale Thinning Process for High Performance Silicon Devices, Abstract 481, 174th Electrochemical Society Mtg., 88 2, 705 (1988).
Janesick et al, Charge Coupled Device Pinning Technologies, SPIE Optical Sensors and Electronic Photography, vol. 1071-15, Jan. 1989.
W. P. Maszara et al, Bonding of Silicon Wafers for Silicon-on-Insulator, J. Appl. Phys. 64 (10) Nov. 1988, 4943.
Seidel et al, Aniostropic Etching of Crystalline Silicone in Alkaline Solutions, J. Electrochem. Soc. vol. 137 No. 11, Nov. 1990, 3626.
Muraoka et al, Controlled Preferential Etching Technology, Semiconductor Silicon 1973, Electrochemical Society, 327, 1973.

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