Method of making assembly module and board module and...

Details Method of making assembly module and board module and... Method of making assembly module and board module and...

2007-08-28

2010-11-16

Bui, Hung S (Department: 2841)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S759000, C361S755000

Reexamination Certificate

active

07835159

ABSTRACT:
A second member is superposed on a first member. A first recognition mark is described on the surface of the first member. A second recognition mark is described on the surface of the second members. The first recognition mark is fragmented along the edge of the second member when the second member is superposed on the first member. The second recognition mark ends at the edge of the second member. The second recognition mark cooperates with the first recognition mark for establishment of a predetermined geometric pattern. The relative positions of the first and second recognition marks can be adjusted based on an irregular or unshaped geometric pattern. The second member can thus reliably be superposed on the surface of the first member at the correct position.

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Chinese Office Action dated Jul. 24, 2009 for related Chinese Application No. 200710149282.1.
Office Action mailed on Apr. 29, 2008 and issued in corresponding Korean Patent Application No. 10-2007-0088835.

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