Fishing – trapping – and vermin destroying
Patent
1993-12-21
1994-11-29
Hearn, Brian E.
Fishing, trapping, and vermin destroying
437214, 437216, 437219, 73517AV, 296211, H01L 2160
Patent
active
053690575
ABSTRACT:
This invention generally relates to the provision of a vent path during the bonding of silicon wafers and the subsequent encapsulation of the individual devices. A double-sided polished silicon wafer is used for the device wafer. The device wafer includes circuitry, thin membranes and metal interconnections. When bonding a bottom wafer to the device wafer, a vented path exists between the wafers. The venting path includes serpentine shape channel formed by interdigitated fingers and cavities. The cavity and the interdigitated patterns can be etched either together or separately into either wafer. A top wafer has a cavity formed therein. When the top device and bottom wafers are bonded together, the venting path is sealed by dipping the device in a sealing liquid. The serpentine path prevents the sealing liquid from reaching the cavity.
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Chilcott Dan W.
Lee Han-Sheng
Logsdon James H.
Staller Steven E.
Brooks Cary W.
Delco Electronics Corporation
Funke Jimmy L.
Hearn Brian E.
Picardat Kevin M.
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