Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate
2000-10-25
2002-03-26
Arbes, Carl J. (Department: 3729)
Metal working
Method of mechanical manufacture
Electrical device making
C029S874000, C029S876000, C029S882000, C439S364000
Reexamination Certificate
active
06360438
ABSTRACT:
TECHNICAL FIELD
The present invention relates generally to an environmentally protected bussed electrical center, and further to a method of fabricating same.
BACKGROUND OF THE INVENTION
A bussed electrical center (hereinafter referred to simply as a “BEC”) is a stand-alone central junction block assembly which has gained increasing applications in the automotive arts as motor vehicles become ever more electronically sophisticated. A BEC packages, for example, various fuses, relays and electronic devices in a single central location. A BEC not only saves cost by consolidating electrical interconnections, it also advantageously reduces the number of cut and spliced leads, thereby increasing reliability. An example of a BEC construction is described in U.S. Pat. No. 5,715,135, to Brussalis et al, dated Feb. 3, 1998.
What remains needed in the art is a BEC in which connections and seams are environmentally sealed.
SUMMARY OF THE INVENTION
The present invention is an environmentally protected (sealed) BEC at the housing seam and at each of the connector receptacles.
The lower housing is formed conventionally, as for example by plastic injection molding of a plastic lower housing body, and may carry a printed circuit board (PCB), a spacer plate and an electrical assemblage including upstanding blade terminals.
The upper housing is formed according to the method of the present invention, in two shots. Firstly, an upper housing body is formed by a plastic injection molding process using a first upper mold member mated to a lower mold member. Next, the first upper mold member is removed, and a second upper mold member is mated to the lower mold member. A liquid injection molding process now injects liquid resilient seal material, preferably silicone, over exposed surfaces of the upper housing body, including the upper housing seam and each connector interface. The liquid then solidifies adheringly to the exposed surfaces of the upper housing body so as to provide a resilient seal thereat.
Accordingly, it is an object of the present invention to provide an environmentally protected BEC via a method which includes a two shot injection process.
This, and additional objects, advantages, features and benefits of the present invention will become apparent from the following specification.
REFERENCES:
patent: 2669702 (1954-02-01), Klostermann
patent: 3571779 (1971-03-01), Collier
patent: 4473267 (1984-09-01), Sadigh-Behzadi
patent: 4664461 (1987-05-01), Schubert et al.
patent: 4764645 (1988-08-01), Takasawa
patent: 4824390 (1989-04-01), Crane et al.
patent: 5017153 (1991-05-01), Bowman
patent: 5227955 (1993-07-01), Le Bris et al.
patent: 5253143 (1993-10-01), Klinger et al.
patent: 5254018 (1993-10-01), Sawada
patent: 5279030 (1994-01-01), Ito et al.
patent: 5764487 (1998-06-01), Natsume
patent: 5777850 (1998-07-01), Jakob et al.
patent: 5782651 (1998-07-01), Konoya
patent: 5822855 (1998-10-01), Szczesny et al.
patent: 6126458 (2000-10-01), Gregory, II et al.
IEEE Trans Components, Packaging and Manufacturing Technology-Part B vol. 18, No. 2 May 1995 pp 235-239 by Steven D. Roobinson et al.
Gladd Joseph Howard
Hickox Jeffrey Michael
Rodondi Andrew F.
Arbes Carl J.
Delphi Technologies Inc.
Twomey Thomas A.
LandOfFree
Method of making an upper housing for a bussed electrical... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method of making an upper housing for a bussed electrical..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of making an upper housing for a bussed electrical... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2859125