Metal working – Method of mechanical manufacture – Electrical device making
Patent
1986-09-02
1987-10-20
Goldberg, Howard N.
Metal working
Method of mechanical manufacture
Electrical device making
29830, 174 685, H05K 310
Patent
active
047004738
ABSTRACT:
An ultra high density pad array chip carrier is disclosed which includes a ceramic substrate having a plurality of electrical conductors each of which connect to a respective through-hole plugged with solder on its bottom surface. These solder plugs form a pad array for the chip carrier as well as provide a hermetic seal for the ceramic substrate. A polymer dielectric layer is affixed to the top surface of the ceramic substrate which provides an insulated metal die mount pad thereon. The electrical conductors on the ceramic substrate are formed using well-known vacuum metallization techniques to achieve much narrower widths. Approximately a 40 percent reduction in overall size and cost is achieved utilizing this improved arrangement, which improves reliability and facilitates post-assembly cleaning of the chip carrier when mounted to its final board.
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IBM Technical Disclosure Bulletin, Auletta and Procopio, vol. 18, No. 11, Apr. 1976, p. 3591 Describes a Module Package having a Flex Circuit Combining the Attributes of TAB with a Pressure Clamp for Interconnecting the Module to a Printed Circuit Board.
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Dorinski Dale
Freyman Bruce J.
Shurboff John
Arbes Carl J.
Goldberg Howard N.
Motorola Inc.
Roney Edward M.
Southard Donald B.
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