Method of making an ultra high-density, high-performance heat si

Details Method of making an ultra high-density, high-performance heat si Method of making an ultra high-density, high-performance heat si

1996-01-11

1998-06-02

Cuda, Irene

Metal working

Method of mechanical manufacture

Heat exchanger or boiler making

29890054, B23P 1500

Patent

active

057584184

ABSTRACT:
An efficient heat sink having a high density of fins and a large effective surface area is formed by coiling a flat strip of thermally conductive material in which teeth or millifins have been formed by a stamping operation, for example. A spacer may be employed to insure fin separation. In an alternate embodiment, the strips are stacked. The resulting heat sink is particularly effective in impingement flow cooling of electronic devices, chips, circuits or modules.

REFERENCES:
patent: 4897712 (1990-01-01), Prokopp
patent: 5406451 (1993-06-01), Korinsky
patent: 5419041 (1995-05-01), Ozeki
patent: 5507092 (1996-04-01), Akechi
Buller, et al., "Inexpensive Omnidirectional Heat Sink", IBM Technical Disclosure Bulletin, vol. 38, No. 5, May, 1995 (AT894-0749) pp. 81-82.
Cutt et al., "Clip-On Heat Sink for Memory Single In-Line Memory Module", IBM Technical Disclosure Bulletin, vol. 32, No. 9B, Feb. 1990 (BC888-0292), pp. 259-260.

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