Method of making an organic composite electrical insulator syste

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor

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29631, 156329, 174179, H01B 1900, H01B 1702, H01B 1766

Patent

active

042126967

ABSTRACT:
An organic composite electrical insulator system includes one or more modular ethylene propylene copolymer elastomeric molded insulators or sheds bonded by a thin line bond to an epoxy or polyester resin bonded fiberglass structural member. In one embodiment, the organic composite insulator system may take the form of a suspension insulator used to support a high voltage power cable from a transmission tower. The suspension insulator includes a pair of metallic end connectors mechanically attached to opposite longitudinal ends of an elongated polyester resin bonded fiberglass core rod. The space between the end connectors along the rod is filled with a plurality of modular ethylene propylene elastomeric molded insulators or sheds having inner diameters smaller than the outside diameter of the rod in order to obtain a slip fit and thereby compressively load the interface surfaces between the sheds and the rod during the manufacture of the rod. All interface surfaces between the sheds and the rod are precoated with an adhesive prior to the assembly of the sheds on the rod. As soon as the adhesive coatings are completely dry, the sheds are stretched over the rod and slid into their final position. The rod with its assembled sheds is then subjected to a moderate temperature cure to bond the sheds to each other and to the rod.

REFERENCES:
patent: 2017519 (1935-10-01), Waldron
patent: 2732423 (1956-01-01), Morrison
patent: 3387839 (1968-06-01), Miller et al.
patent: 3802989 (1974-04-01), Huber
patent: 3898372 (1975-08-01), Kalb
O'Malley, Wm. J., "Silicone Pressure-Sensitive Adhesives for Flexible Printed Circuits", Adhesives Age, Jun. 1975, pp. 17-20.

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