Metal treatment – Process of modifying or maintaining internal physical... – Chemical-heat removing or burning of metal
Patent
1979-03-05
1980-04-22
Dean, R.
Metal treatment
Process of modifying or maintaining internal physical...
Chemical-heat removing or burning of metal
29569L, 29580, 148171, 250211J, 313500, 357 17, 357 55, 357 90, H01L 2176, H01L 3300, H01L 2120
Patent
active
041993853
ABSTRACT:
Monolithic light emitting diode arrays may be fabricated by using a two layer binary semiconductor substrate wafer providing a gradient of ingredient concentration in one portion of the wafer and forming p-n junctions to a desired depth in the graded concentrated wafer and selectively removing portions of the opposite side of the wafer adjacent to said p-n junctions in order to permit light of varying colors to escape and to provide optical isolation. Metallurgical pads are provided to each of the p-n junctions for solder reflow type connections.
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Hung Roland Y.
Shih Kwang K.
Dean R.
International Business Machines - Corporation
Riddles Alvin J.
Saba W. G.
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