Method of making an interface layer for stacked lamination sizin

Details Method of making an interface layer for stacked lamination sizin Method of making an interface layer for stacked lamination sizin

1996-10-08

1998-09-01

Brunsman, David

Plastic and nonmetallic article shaping or treating: processes

Forming continuous or indefinite length work

By casting liquids on a solid supporting or shaping surface

264217, 264334, 1061761, 1061843, 1061921, 1061941, 1061991, B29D 701

Patent

active

058007610

ABSTRACT:
An interface layer for separating first and second microelectronic ceramic substrates during firing includes a thermally degradable binder, preferably a polymer, that degrades at temperatures above room temperature and below a firing temperature for the microelectronic ceramic substrates, and a separating material, such as boron nitride or graphite. The method of making the interface layer includes mixing the binder, one or more solvents for the binder, a plasticizer and the separating material for a sufficient period of time to form a homogeneous mass, then casting the material in a thin sheet to form the interface layer.

REFERENCES:
patent: 2880147 (1959-03-01), Cunningham
patent: 2959978 (1960-10-01), Reeves et al.
patent: 4353958 (1982-10-01), Kita et al.
patent: 5660781 (1997-08-01), Moriya et al.
CA 108:209086, Nakajima et al "Slurries for casting Boron Nitride powder", 26 Feb. 1988.
CA 121:16191, Matsuhisa et al "Method and apparatus for the manufacture of ceramics by injection molding", 24 Aug. 1993.

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