Method of making an integrated circuit substrate lead assembly

Details Method of making an integrated circuit substrate lead assembly Method of making an integrated circuit substrate lead assembly

1992-09-14

1993-10-19

Cuda, Irene

Metal working

Method of mechanical manufacture

Electrical device making

29840, 174522, 174524, B23P 1500

Patent

active

052534154

ABSTRACT:
A lead assembly and method for forming electrical connections between pads on an integrated circuit chip and pads on a circuit board includes small diameter wires adhesively bonded to a supporting tape. The wires may be inwardly fanned to form connections between relatively widely spaced circuit board pads and relatively closely spaced chip pads.

REFERENCES:
patent: 3674602 (1972-07-01), Keogh et al.
patent: 3674914 (1972-07-01), Burr
patent: 3816205 (1974-06-01), Krag
patent: 3882597 (1975-05-01), Chayka et al.
patent: 4140265 (1979-02-01), Morino
patent: 4171477 (1979-10-01), Funari
patent: 4450623 (1984-05-01), Burr
patent: 4541882 (1985-09-01), Lassen
patent: 4651415 (1987-03-01), Frampton
patent: 4653174 (1987-03-01), Gilder, Jr. et al.
patent: 4704187 (1987-11-01), Fujita
patent: 4711700 (1987-12-01), Cusack
patent: 4733292 (1988-03-01), Jarvis
patent: 4790897 (1988-12-01), Long
patent: 4790898 (1988-12-01), Woods
patent: 4806106 (1989-02-01), Mebane et al.
patent: 4814855 (1989-03-01), Hodgson et al.
patent: 4820658 (1989-04-01), Gilder, Jr. et al.
patent: 4839717 (1989-06-01), Phy et al.
patent: 4859614 (1989-08-01), Sugahara et al.
patent: 4870474 (1989-09-01), Karashima
patent: 4899207 (1990-02-01), Hallowell et al.
patent: 4918260 (1990-04-01), Griffith et al.
patent: 4933810 (1990-06-01), Cardashian et al.
patent: 4949224 (1990-08-01), Yamamura et al.
patent: 4967261 (1990-10-01), Niki et al.
patent: 4979663 (1990-12-01), Sofia et al.
patent: 4981817 (1991-01-01), Stone, Jr.
patent: 4985748 (1991-01-01), Belanger, Jr.
patent: 5053922 (1991-10-01), Matta et al.
patent: 5061988 (1991-10-01), Rector
patent: 5113580 (1992-05-01), Schroeder
patent: 5152056 (1992-10-01), Shook

Affiliated with

Also associated with

Rating

Method of making an integrated circuit substrate lead assembly does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of making an integrated circuit substrate lead assembly, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of making an integrated circuit substrate lead assembly will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1343763