Method of making an integrated circuit structure by using a non-

Details Method of making an integrated circuit structure by using a non- Method of making an integrated circuit structure by using a non-

1994-11-07

1995-12-05

Chaudhari, Chandra

Fishing, trapping, and vermin destroying

437190, 437192, H01L 21441

Patent

active

054729122

ABSTRACT:
A conductive layer is formed over an insulating layer and extending down into a contact opening. An insulating layer is then deposited over the device and in the opening, and etched back to form a plug of dielectric material in the bottom of the opening. An aluminum layer is then deposited over the device and in the opening under such conditions as to cause a substantially complete fill of the opening by the aluminum, and result in a planar surface above the opening.

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