Method of making an integrated circuit package with flat-topped

Details Method of making an integrated circuit package with flat-topped Method of making an integrated circuit package with flat-topped

1997-01-22

1998-01-27

Cuda, Irene

Metal working

Method of mechanical manufacture

Heat exchanger or boiler making

29428, B23P 1526

Patent

active

057110697

ABSTRACT:
An integrated circuit package is disclosed, of the type having a pin-fin heat sink attached to the surface. A flat plate is attached to the ends of the pins of the heat sink, to provide a planar surface area of adequate size to allow a vacuum pickup tool to pick and place the packaged integrated circuit, and to receive marking and symbolization.

REFERENCES:
patent: 4607277 (1986-08-01), Hasson et al.
patent: 4765400 (1988-08-01), Ohu et al.
patent: 4770242 (1988-09-01), Daikoku et al.
patent: 4908695 (1990-03-01), Morihara et al.
patent: 5052481 (1991-10-01), Horvath et al.
patent: 5083373 (1992-01-01), Hamburger
patent: 5113315 (1992-05-01), Capp et al.
patent: 5345107 (1994-09-01), Daikoku et al.
IBM Technical Disclosure Bulletin, vol. 27, No. 3, Aug. 1984, p. 1438, "Integral Heat Sink/Module Cap", Furkay et al.
IBM Technical Disclosure Bulletin, vol. 36, No. 12, Dec. 1993, pp. 625-626, "Heatsink Stand for Fully Encapsulated Substrate".
Patent Abstracts of Japan, vol. 12, No. 67 (M-673), Mar. 2, 1988 & JP-A-62 213691.

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