Etching a substrate: processes – Forming or treating thermal ink jet article
Reexamination Certificate
2005-03-15
2005-03-15
Alanko, Anita (Department: 1765)
Etching a substrate: processes
Forming or treating thermal ink jet article
C216S051000, C216S067000, C216S079000, C216S099000
Reexamination Certificate
active
06866790
ABSTRACT:
A method of forming a fluid ejecting device such as an ink jet printing device that includes forming a plurality of fluid drop generators on a first surface of a silicon substrate, forming a partial fluid feed slot in the silicon substrate by deep reactive ion etching, and forming a fluid feed slot by wet etching the partial fluid feed slot.
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Milligan Donald J
Weber Timothy L.
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