Fishing – trapping – and vermin destroying
Patent
1990-02-22
1990-10-16
Chaudhuri, Olik
Fishing, trapping, and vermin destroying
148DIG72, 148DIG97, 148DIG160, 156610, 437110, 437111, 437976, H01L 2120
Patent
active
049635085
ABSTRACT:
A semiconductor wafer having an epitaxial GaAs layer, including a monocrystalline Si substrate having a major surface which is inclined at an off angle between 0.5.degree. and 5.degree. with respect to (100); and at least one intermediate layer epitaxially grown on the major surface of the monocrystalline Si substrate, as a buffer layer for accommodating a lattice mismatch between the Si substrate and the epitaxial GaAs layer which is epitaxially grown on a major surface of the top layer of the at least one intermediate layer. The at least one intermediate layer may comprise one or mor GaP/GaAsP, GaAsP/GaAs superlattice layers. the wafer may be used to produce a seimconductor light emitting element which has a plurality of crystalline gaAs layers including a light emitting layer epitaxially grown on the GaAs layer on the intermediate layer. The wafer may also be used to produce a compound semiconductor device such as amplifying and switching elements, light emitting and receiving elements and photovolataic elements. Methods for producing the semiconductor wafer, light emitting element and compound semiconductor devices are also disclosed.
REFERENCES:
patent: 4088515 (1978-05-01), Blakesbe et al.
patent: 4120706 (1978-10-01), Mason
patent: 4558336 (1985-12-01), Chang et al.
patent: 4561916 (1985-12-01), Akiyama et al.
patent: 4632712 (1986-12-01), Fan et al.
patent: 4675709 (1987-06-01), Scifres et al.
patent: 4774205 (1988-09-01), Choi et al.
patent: 4826784 (1989-05-01), Salerno et al.
patent: 4835116 (1989-05-01), Lee et al.
Kemlage, "Deposition of GaP Heteroepitaxy on Silicon", IBM TDB, vol. 18, No. 6, Nov. 1975, p. 1852.
Fischer et al., "Characteristics . . . (100) Silicon", Electron. Lett., vol. 20, No. 22, 25 Oct. 1984, pp. 945-947.
Metze et al., "Metal-Semiconductor . . . Epitaxy", Appl. Phys. Lett., vol. 45, No. 10, 15 Nov. 1984, pp. 1107-1109.
Tischler et al., "Defect Reduction . . . Superlattice", Appl. Phys. Lett., vol. 46, No. 3, Feb. 1985, pp. 294-296.
Osbourn et al., "A GaAs.sub.x P.sub.1-x /GaP Strained-Layer Supterlattice", Appl. Phys. Lett., vol. 41 No. 2, 15 Jul. 1982, pp. 172-174.
Kim et al., "Electronic Structure of GaP-AlP(100) Superlattices", J. Vac. Sci. Tech. vol. 21, No. 2, Jul./Aug. 1982, pp. 528-530.
Fan et al., "Heteroepitaxy on Silicon II", Mat. Res. Soc. Symp. Proc., vol. 91, 1987, pp. 99-103.
Sakai Shiro
Umeno Masayoshi
Yahagi Shin'ichiro
Bunch William
Chaudhuri Olik
Daido Tokushuko Kabushiki Kaisha
Nagoya Institute of Technology
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