Method of making an engineering change to a printed wiring board

Details Method of making an engineering change to a printed wiring board Method of making an engineering change to a printed wiring board

1991-09-27

1993-01-26

Eley, Timothy V.

Metal working

Method of mechanical manufacture

Converting

29423, 29840, H05K 334

Patent

active

051813173

ABSTRACT:
A method of making an engineering change to a printed wiring board changes connection for a terminal of an electronic component which is mounted on the printed wiring board through a terminal pad. The terminal is electrically connected to a destination through the terminal pad and wiring within the printed wiring board. The present invention places an insulator, including an insulating material and a conductive layer formed thereon, between the terminal and the terminal pad. The electronic component is mounted on the printed wiring board and the terminal is electrically connected to the conductive layer. A discrete wire is placed between the conductive layer and the destination.

REFERENCES:
patent: 3294951 (1966-12-01), Olson
patent: 4631820 (1986-12-01), Harada et al.
patent: 4933305 (1990-06-01), Kikhawa
patent: 5001829 (1991-03-01), Schelhorn

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