Method of making an encircling groove on the edge of a semicondu

Details Method of making an encircling groove on the edge of a semicondu Method of making an encircling groove on the edge of a semicondu

1987-10-15

1988-12-27

Schmidt, Frederick R.

Abrasive tool making process, material, or composition

Impregnating or coating an abrasive tool

51327, B24B 100

Patent

active

047931019

ABSTRACT:
In a method of making an encircling groove (8) on the edge of a semiconductor slice (5) of a power semiconductor component, first of all the edge is surface-ground and then the groove (8) is ground in one operation by means of a form-grinding wheel (3) correspondingly contoured on the edge. An especially high output is achieved with diamond grinding wheels of appropriate grain size and suitable bond.

REFERENCES:
patent: 2293291 (1942-08-01), Gaspari
patent: 3628294 (1971-12-01), Stattler et al.
patent: 4286415 (1981-09-01), Loreto
patent: 4344260 (1982-08-01), Ogiwara

Affiliated with

Also associated with

Rating

Method of making an encircling groove on the edge of a semicondu does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of making an encircling groove on the edge of a semicondu, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of making an encircling groove on the edge of a semicondu will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-860276