Method of making an electronic package with enhanced heat sinkin

Details Method of making an electronic package with enhanced heat sinkin Method of making an electronic package with enhanced heat sinkin

1993-02-16

1993-11-23

Arbes, Carl J.

Metal working

Method of mechanical manufacture

Electrical device making

29832, 174 163, 257675, 257712, H05K 334

Patent

active

052632458

ABSTRACT:
An electronic package which includes a substrate having a dielectric layer, a circuitized layer located on one surface of the dielectric and a thermally and electrically conductive layer located on a second surface of the dielectric, this thermally and conductive layer designed for providing enhanced heat removal from the package's semiconductor device. A pedestal element is located on or formed as part of the thermal and electrically conductive layer, and extends through the dielectric and circuitized layers for having the semiconductor device positioned thereon. The semiconductor device is thus in substantially direct thermal communication with the pedestal element and thus the adjacent, thick thermal conductive layer which functions as the package's heat sink. In one embodiment, solder is provided on the pedestal element to interconnect desired portions of the circuitized layer with the pedestal element (e.g., to provide electrical ground). A method of making such an electronic package is also defined herein.

REFERENCES:
patent: 3665256 (1972-05-01), Goun et al.
patent: 3825803 (1974-07-01), Budde
patent: 3930114 (1975-12-01), Hodge
patent: 4563725 (1986-01-01), Kirby
patent: 4654966 (1987-04-01), Kohara et al.
patent: 4718163 (1988-01-01), Berland et al.
patent: 4724611 (1988-02-01), Hagihara
patent: 5175612 (1992-12-01), Long et al.

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