Metal working – Method of mechanical manufacture – Electrical device making
Patent
1995-02-01
1996-05-28
Arbes, Carl J.
Metal working
Method of mechanical manufacture
Electrical device making
174 524, 174 525, 257666, 437211, 437220, H05K 334
Patent
active
055199364
ABSTRACT:
An electronic package which includes a rigid support member, e.g., copper sheet, to which is bonded both the package's semiconductor chip and circuitized substrate members. The chip is bonded using a thermally conductive adhesive while the circuitized substrate, preferably a flexible circuit, is bonded using an electrically insulative adhesive. The chip is electrically coupled to designated parts of the circuitry of the substrate, preferably by wire, thermocompression or thermosonic bonding. An encapsulant may be used to cover and protect the connections between the chip and substrate. This package may in turn be electrically coupled to a separate, second substrate such as a PCB.
REFERENCES:
patent: 4649418 (1987-03-01), Uden
patent: 4766670 (1988-08-01), Gazdik et al.
patent: 4868349 (1989-09-01), Chia
patent: 4890152 (1989-12-01), Hirata et al.
patent: 4992850 (1991-02-01), Corbett et al.
patent: 5023202 (1991-06-01), Long et al.
patent: 5032543 (1991-07-01), Black et al.
patent: 5045921 (1991-09-01), Lin
patent: 5095404 (1992-03-01), Chao
patent: 5114880 (1992-05-01), Lin
patent: 5133118 (1992-07-01), Lindblad et al.
patent: 5168430 (1992-12-01), Nitsch et al.
patent: 5220487 (1993-06-01), Patel et al.
patent: 5263245 (1993-11-01), Patel et al.
patent: 5285352 (1994-02-01), Pastore et al.
Research Disclosure, Feb. 1991, No. 322, "Wire Bonded Chips Mounted to Dynamic Flex Cables (Directly to Stiffener)", Author Anonymous.
"Card Assembly Implication in Using the TBGA Module", May 18, 1993, P. Mescher.
"Area Array Tab Package Technology", F. Andros and R. Hammer.
IBM Technical Disclosure Bulletin, vol. 31, No. 8, Jan. 1989, pp. 135-138, "Thin Film Module", by Chen et al.
Andros Frank E.
Bupp James R.
DiPietro Michael
Hammer Richard B.
Arbes Carl J.
Fraley Lawrence R.
International Business Machines - Corporation
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