Method of making an electronic package having spacer elements

Details Method of making an electronic package having spacer elements Method of making an electronic package having spacer elements

1996-07-23

1998-06-09

Heinrich, Samuel M.

Metal fusion bonding

Solder form

228 41, H05K 334, B23K 300

Patent

active

057622582

ABSTRACT:
A method of precisely positioning a quantity of conductive spacers (e.g., spherically shaped solder balls) on respective conductive pads (e.g., copper pads) of an underlying substrate (e.g., an FR4 printed circuit board or flexible circuit member) wherein the spacers are forcibly retained within a suitable holder and, when engaged with the respective pads, reflowed to effect a plurality of positive electrical connections between the spacers and pads. Such forcible retention allows for partial extension of the spacers from the invention's carrier, which is also disclosed.

REFERENCES:
patent: 3472365 (1969-10-01), Tiedema
patent: 4209893 (1980-07-01), Dyce et al.
patent: 4712721 (1987-12-01), Noel et al.
patent: 4830264 (1989-05-01), Bitaillou et al.
patent: 4871110 (1989-10-01), Fukasawa et al.
patent: 5118027 (1992-06-01), Braun et al.
patent: 5159171 (1992-10-01), Cook et al.
patent: 5324569 (1994-06-01), Nagesh et al.
patent: 5439162 (1995-08-01), George et al.
patent: 5662262 (1997-09-01), McMahon et al.
Intl. Elec.Packaging Comf., Sep. 1993, vol. 2, pp. 740-748, .C-5 Solder Sphere Robotic Placement Cell For Overmolded Pad Array Carrier. by Martin.

Affiliated with

Also associated with

Rating

Method of making an electronic package having spacer elements does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of making an electronic package having spacer elements, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of making an electronic package having spacer elements will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2191690