Method of making an electronic package having spacer elements

Details Method of making an electronic package having spacer elements Method of making an electronic package having spacer elements

1998-02-09

1999-08-24

Young, Lee W.

Metal fusion bonding

Process

Preplacing solid filler

228212, 228253, 228254, 29743, 29840, 269 21, 269903, B23K 3102

Patent

active

059414499

ABSTRACT:
A method of precisely positioning a quantity of conductive spacers (e.g., spherically shaped solder balls) on respective conductive pads (e.g., copper pads) of an underlying substrate (e.g., an FR4 printed circuit board or flexible circuit member) wherein the spacers are forcibly retained within a suitable holder and, when engaged with the respective pads, reflowed to effect a plurality of positive electrical connections between the spacers and pads. Such forcible retention allows for partial extension of the spacers from the invention's carrier, which is also disclosed.

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Intl. Elec.Packaging Conf., Sep. 1993, vol. 2, pp. 740-748, .C-5 Solder Sphere Robotic Placement Cell For Overmolded Pad Array Carrier. by Martin.

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