Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate
2005-11-08
2005-11-08
Tugbang, A. Dexter (Department: 3729)
Metal working
Method of mechanical manufacture
Electrical device making
C029S831000, C029S832000, C029S842000, C029S845000, C361S767000, C216S072000
Reexamination Certificate
active
06961995
ABSTRACT:
An electronic package and method of making the electronic package is provided. A layer of dielectric material is positioned on a first surface of a substrate which includes a plurality of conductive contacts. At least one through hole is formed in the layer of dielectric material in alignment with at least one of the plurality of conductive contacts. A conductive material is positioned in the at least one through hole substantially filling the through hole. At least one conductive member is positioned on the conductive material in the through hole and in electrical contact with the conductive material. The electronic package improves field operating life of an assembly which includes a semiconductor chip attached to a second surface of the substrate and a printed wiring board attached to the conductive members.
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Jimarez Lisa J.
Jimarez Miguel A.
Markovich Voya R.
Milkovich Cynthia S.
Perry Charles H.
Jordan John A.
Nguyen Tai
Steinberg William H.
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