Method of making an electronic component using reworkable underf

Details Method of making an electronic component using reworkable underf Method of making an electronic component using reworkable underf

1998-07-02

2000-05-02

Seidleck, James J.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Compositions to be polymerized by wave energy wherein said...

522 96, 522 90, 522104, 522107, 522148, 174 521, 174 522, 438107, 438108, 438118, 438127, 29841, 29 2501, H01L 2100, H01L 2144, H01L 2148, C08F 246, H02G 308

Patent

active

060573813

ABSTRACT:
A method is disclosed for preparing an electronic assembly using a reworkable underfill encapsulant in which the encapsulant is cured in situ from a curable composition comprising one or more mono-functional maleimide compounds, or one or more mono-functional vinyl compounds other than maleimide compounds, or a combination of maleimide and vinyl compounds, a curing initiator and optionally, one or more fillers or adhesion promoters.

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