Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Including adhesive bonding step
Reexamination Certificate
1999-04-19
2001-08-28
Graybill, David E. (Department: 2814)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Including adhesive bonding step
C438S119000
Reexamination Certificate
active
06281048
ABSTRACT:
FIELD OF THE INVENTION
The present invention relates to a method of making an electronic component, and to an electronic component of the type obtained by implementing said method. More precisely, the invention relates to making a component which comprises an insulating substrate provided with conductive tracks, and at least one semiconductor chip mounted on said insulating substrate.
BACKGROUND OF THE INVENTION
Many examples are known in which a semiconductor chip is mounted on a printed circuit, in particular a printed circuit of small size. For example, this applies to electronic memory cards, regardless of whether they are of the “contact” type or of the “contactless” type, i.e. of the type in which data and energy are conveyed between the card and the reader by electromagnetic waves.
In a contact type of electronic memory card, the conductive tracks of the printed circuit serve to connect the external contact areas of the card to the terminals of the semiconductor chip so as to form an electronic module. In a contactless type of electronic memory card, the metal-plating serves as the antenna of the card and to connect the card to the semiconductor chip.
For all of these applications and for many other applications, known techniques for forming the conductive tracks of the printed circuit involve depositing a copper pattern on or fixed to a flexible or rigid insulating support, which copper pattern includes copper wires or wires made of some other metal, or in disposing a copper film which is then chemically etched to obtain the desired tracks. The chip is then fixed to the corresponding zone of the printed circuit.
Such techniques for making the printed circuit are relatively costly, whereas the manufacturing cost of the card, and thus of the module including the semiconductor die, must be as low as possible.
SUMMARY OF THE INVENTION
An object of the invention is to make an electronic is component comprised of a printed circuit element to which at least one semiconductor chip or die is fixed, in such a way that the manufacturing cost is low compared with the costs of known techniques.
These and other objects are attained in accordance with one aspect of the invention by making an electronic component of the chip card type, comprising an insulating substrate provided with an antenna-forming conductive track, and a semiconductor chip mounted on said substrate. The antenna-forming conductive track is formed on the substrate by screen printing using a polymerizable conductive ink. A semiconductor chip as provided with contact areas is supplied. Conductive terminals such as “bumps” are formed on at least some of the contact areas. The chip is disposed on the substrate, before the conductive ink is dry, so that the ends of the bumps penetrate into the ink at the corresponding locations.
Advantageously, the chip is fixed mechanically to the substrate by polymerizing an insulating adhesive resin disposed between the bottom face of the chip and the top face of the substrate.
It can be understood that, by forming the conductive tracks of the printed circuit by screen printing using a conductive ink, it is possible to reduce the cost very significantly compared with conventional techniques using metal plating that is then etched, or in which a pre-cut copper sheet is applied.
It can also be understood that, since the semiconductor chip as provided with its projecting connection terminals is put in place before the screen-printed ink is dry, very good electrical contact is achieved between the chip and the conductive tracks, without it being necessary to use a conductive adhesive, as is necessary in prior techniques.
In a first implementation, the adhesive resin is disposed between the substrate and the chip after the chip has been put in place on the substrate.
In a second implementation, the insulating adhesive resin is disposed on the bottom face of the chip before the chip is put in place on the substrate.
Another aspect of the invention provides an electronic component comprising an insulating substrate provided with a conductive track formed with a conductive ink, a semiconductor chip provided with contact areas, and mechanical fixing means for fixing the chip mechanically to the substrate, wherein at least some of the contact areas are provided with respective conductive terminals such as bumps, and wherein the ends of the bumps penetrate into the conductive ink serving to form said tracks.
It can be understood that a component is thus obtained in which the electrical connection between the chip and the conductive track results from the ends of the bumps penetrating into the ink forming the conductive tracks.
REFERENCES:
patent: 4955132 (1990-09-01), Ozawa
patent: 5566441 (1996-10-01), Marsh et al.
patent: 5672542 (1997-09-01), Schwiebert et al.
patent: 0 449 496 (1991-10-01), None
patent: 0 704 899 (1996-04-01), None
patent: 0 810 649 (1997-12-01), None
patent: WO 97/27646 (1997-07-01), None
Girard Sophie
Vere Denis
Frishauf, Holtz Goodman, Langer & Chick, P.C.
Graybill David E.
Schlumberger Systemes
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