Method of making an electronic assembly

Details Method of making an electronic assembly Method of making an electronic assembly

2006-03-22

2008-09-09

Arbes, C. J (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S842000, C029S843000, C029S874000, C029S884000

Reexamination Certificate

active

07421778

ABSTRACT:
According to one aspect of the invention, an electronic assembly is provided. The electronic assembly includes a first substrate having an integrated circuit formed therein and a second substrate. The first and second substrates are interconnected by a plurality of bi-material interconnects that are electrically connected to the integrated circuit and have a first component comprising a conductive first material with a first coefficient of thermal expansion and a second component comprising a second material with a second coefficient of thermal expansion. The first and second components are connected and shaped such that when the temperature of the bi-material interconnects changes the interconnects each bend towards the first or second component. When the temperature of the second substrate increases, the second substrate expands away from a central portion thereof. The bi-material interconnects are arranged such that the bi-material interconnects bend away from the central portion of the second substrate.

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Office Communication mailed May 30, 2006, U.S.Appl. No. 10/833,433, Filed Jun. 30, 2004, Confirmation No. 3581.

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