Semiconductor device manufacturing: process – Making device or circuit emissive of nonelectrical signal – Substrate dicing
Patent
1996-10-01
1999-03-30
Dutton, Brian
Semiconductor device manufacturing: process
Making device or circuit emissive of nonelectrical signal
Substrate dicing
438 31, 359619, H01L 2100, G02B 2710
Patent
active
058888411
ABSTRACT:
Electro-optical device characterized by having been formed into an individual unit with an integral lens, and method to form the device. A lens, for instance a length of cylindrical microlens, is aligned with a diode strip having a plurality of diodes, for instance laser diodes, and attached to the lens. Subsequent to this attachment, the composite structure consisting of the diode strip having attached to it the lens is sectioned into individual diodes, each of which has a integral lens attached thereto.
REFERENCES:
patent: 4588261 (1986-05-01), Erhardt
patent: 5155631 (1992-10-01), Synder et al.
patent: 5514888 (1996-05-01), Sano et al.
Blue Sky Research
Dutton Brian
LandOfFree
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