Chemistry: electrical and wave energy – Processes and products
Patent
1988-07-21
1989-03-07
Tufariello, T. M.
Chemistry: electrical and wave energy
Processes and products
C25D 502
Patent
active
048103322
ABSTRACT:
A method of making an electrical multilayer copper interconnect in which the electrical lines are protected by an electroplated overcoat. A plating interconnect is deposited on a substrate, a sacrificial layer of dielectric material is deposited on the plating interconnect. Thereafter a plating mask is formed on the dielectric material. Two self-aligned plating masks are patterned in one step, one of which is a plating mask for copper plating and the other is a plating mask for the overcoat. Preferably, before electroplating the overcoat, the copper is etched for exposing the sides adjacent the dielectric layer for allowing overcoating all of the copper.
REFERENCES:
patent: 3745094 (1973-07-01), Greene
patent: 4082591 (1978-04-01), Morisaki et al.
patent: 4159222 (1979-06-01), Lebow et al.
patent: 4190474 (1980-02-01), Berdan et al.
patent: 4233344 (1980-11-01), Brasch
patent: 4409037 (1983-10-01), Landau
Jensen et al, Copper/Polyimide Materials for High Performance Packaging, 12/84, IEEE Transactions on Components, Hybrids, and Mfg. Tech., vol. CHMT-7, #4, pp. 384-393.
Taylor et al., The Wafer Transmission Module-Wafer Scale Integration Packaging, 1985, IEEE 1985 Custom Integrated Circuits Conference, pp. 55-58.
Microelectronics and Computer Technology Corporation
Tufariello T. M.
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