Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate
2006-12-29
2010-10-12
Nguyen, Donghai D. (Department: 3729)
Metal working
Method of mechanical manufacture
Electrical device making
C029S874000, C439S095000
Reexamination Certificate
active
07810235
ABSTRACT:
A method is disclosed for making a connector for preventing electrostatic discharge during connection of a USB-type connector. The connector includes a grounding clip provided within a recess formed at least partially down into the surface of the second level of the base block. The grounding clip may have a proximal end affixed to a proximal end of a signal ground pin of the plurality of signal pins, though the grounding clip and signal ground pin may be coupled at other locations along their lengths. The connector including the grounding clip may be affixed to a semiconductor device. A portion of the grounding clip is provided at a height above the surface of the base block such that, when a shroud is slid around the connector, the shroud engages and remains in contact with the grounding clip. Accordingly, any electrostatic discharge built up in the shroud travels from the shroud, through the ESD grounding clip, to the signal ground pin where it is harmlessly dissipated.
REFERENCES:
patent: 4738628 (1988-04-01), Rees
patent: 4889497 (1989-12-01), Riches
patent: 5149224 (1992-09-01), Smith
patent: 5240424 (1993-08-01), Honma et al.
patent: 5735699 (1998-04-01), Tan et al.
patent: 5749741 (1998-05-01), Bellas et al.
patent: 5893766 (1999-04-01), Bellas et al.
patent: 5906496 (1999-05-01), DelPrete et al.
patent: 6074223 (2000-06-01), Huang
patent: 6093057 (2000-07-01), Lok
patent: 6142795 (2000-11-01), Kieninger et al.
patent: 6309255 (2001-10-01), Yu
patent: 6702616 (2004-03-01), Chang et al.
patent: 6733810 (2004-05-01), Roth
patent: 6780068 (2004-08-01), Bartholoma et al.
patent: 6854984 (2005-02-01), Lee et al.
patent: 7108560 (2006-09-01), Chou et al.
patent: 2002/0048976 (2002-04-01), Zhu et al.
patent: 2003/0157836 (2003-08-01), Morikawa et al.
Response to Office Action dated Mar. 3, 2008, U.S. Appl. No. 11/618,280.
Notice of Allowance dated Apr. 7, 2008, U.S. Appl. No. 11/618,280.
Notice of Allowance and Fee(s) Due dated May 1, 2009 in U.S. Appl. No. 11/465,045.
International Search Report and Written Opinion mailed May 9, 2008, International Application No. PCT/US2007/088838.
International Preliminary Report on Patentability and Written Opinion of the International Searching Authority dated Jun. 30, 2009 in PCT Application No. PCT/US2007/088838.
U.S. Appl. No. 11/618,280, filed Dec. 29, 2006.
Office Action dated Nov. 1, 2007, U.S. Appl. No. 11/618,280, filed Dec. 29, 2006.
Vinson et al., “Electrostatic Discharge in Semiconductor Devices: An Overview”, Proceedings of the IEEE, vol. 86, No. 2, Feb. 1998, pp. 399-418.
Restriction Requirement dated Aug. 13, 2007, U.S. Appl. No. 11/618,280, filed Dec. 29, 2006.
Response to Restriction Requirement dated Sep. 11, 2007, U.S. Appl. No. 11/618,280, filed Dec. 29, 2006.
Collantes Patricio
Parikh Dhaval
Sprouse Steven
Nguyen Donghai D.
SanDisk Corporation
Vierra Magen Marcus & DeNiro LLP
LandOfFree
Method of making an electrical connector with ESD grounding... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method of making an electrical connector with ESD grounding..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of making an electrical connector with ESD grounding... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4230353