Etching a substrate: processes – Forming or treating electrical conductor article – Forming or treating of groove or through hole
Reexamination Certificate
1998-06-19
2003-01-28
Alanko, Anita (Department: 1765)
Etching a substrate: processes
Forming or treating electrical conductor article
Forming or treating of groove or through hole
C216S047000
Reexamination Certificate
active
06511607
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to an electrical connecting member for electrically connecting electrical circuit components and a manufacturing method therefor.
2. Related Background Art
As a method for obtaining electrical connecting states between electric circuit components, there are a wire bonding method and an automated bonding method using the tape carrier system which are disclosed in Japanese Patent Laid-Open Application No. 59-139636 and others, that is, the so-called TAB (Tape Automated Bonding) method.
However, not only do these methods involve high costs, but with them, the numbers of junctions are increased between the electric circuit components, and still more there is encountered a problem that it is impossible to apply them if the density of the junctions becomes high.
Also, with these methods, an overall connecting condition cannot be obtained between many of the junctions. As a result, an enormous amount of processes are required, thus creating a problem that the cost reduction is limited.
To overcome such difficulties, there is known a technique to connect electric circuit components themselves electrically using the electrical connecting members held in the insulated containers in which a plurality of conductive members are provided in an insulated state with each other.
For manufacturing an electrical connecting member such as this, there have been proposed those methods which are disclosed in Japanese Laid-Open Application No. 63-222437, Japanese Patent Laid-Open Application No. 63-228726, Japanese Patent Laid-Open Application No. 63-246835, and Japanese Patent Laid-Open Application No. 2-49385, for example.
FIG.
17
A and
FIG. 17B
are views schematically illustrating such electrical connecting members as well as the electrical connection between the electric circuit components using this member. In
FIG. 17
, a reference numeral
171
designates an electrical connecting member, and
172
and
173
, the electric circuit components to be connected. The electrical connecting member
171
is constructed with a holding member
175
made of an electrical insulator containing a plurality of conductive members
174
made of metals or alloys in such a manner that the conductive members
174
are electrically insulated from themselves. One end portion
178
of the conductive member
174
is projected toward one of the electric circuit components
172
side while the other end portion
179
of the conductive member
174
is projected toward the other one of the electric circuit component
173
side (FIG.
17
A). Then, to the junctions
176
of one of the electric circuit components
172
, the one projected end portions
178
of the conductive member
174
are coupled by the thermocompression bonding or compression bonding which causes them to be deformed and alloyed while to the junctions
177
of the other one of the electric circuit component
173
, the other projected end portions
179
of the conductive member
174
are coupled by the thermocompression bonding which causes them to be deformed and alloyed or compression bonding which causes them to be deformed (FIG.
17
B). In this way, the corresponding junctions
176
and
177
of the electric circuit components
172
and
173
are connected.
In an electrical connecting member such as this, there are the advantages given below.
(1) The junctions of the electric circuit component can be made small by making the size of the conductive member fine, and the number of junctions can also be increased. Hence, the electric circuit components themselves can be connected with a high density.
(2) Even for the electric circuit components having different thicknesses, it is possible to make the height of the electric circuit components always constant by changing the thicknesses of the electrical connecting members. Consequently, a multi-layer connection can be implemented easily and an assembly can be performed with a higher density.
(3) It is possible to perform a stabilized connection by making the height of the projections of the conductive member to be coupled to the junctions of the electric circuit component even when the junctions of the electric circuit component are lower than the surface. Accordingly, the electric circuit components themselves can be connected easily even if their shapes are complicated.
For manufacturing an electrical connecting member of the kind, there has been proposed a conventional method which is disclosed in Japanese Patent Laid-Open Application No. 2-49385. Hereinafter, in conjunction with
FIG. 18
, this manufacturing method will be described.
FIG.
18
A through
FIG. 18E
are cross-sectional views schematically illustrating the principal processes of the method for manufacturing an electrical connecting member. At first, a metallic sheet
181
is prepared for a substrate (FIG.
18
A). Then, on this metallic sheet
181
, a negative-type photosensitive resin film
182
is formed by coating polyimide resin and others to construct a holding member by spinners, and a prebaking is given at a temperature of approximately 100° C. (FIG.
18
B). Light is irradiated on the photosensitive resin film
182
through a photomask (not shown) having a predetermined pattern to cause it to be exposed and developed (FIG.
18
C). Thus, the photosensitive resin film
182
is left on the exposed portions whereas the photosensitive film on the portions which are not exposed is removed by the development treatment to form holes
183
at the bottom of which the surface of the metallic sheet
181
is exposed. The photosensitive resin film
182
is hardened by raising the temperature from 200 to 400° C. Then, the member thus processed is immersed in an etching solution and the etching is given to the exposed surface of the metallic sheet in the holes
183
to form the concavities
184
which are conductively connected to the holes
183
respectively (FIG.
18
D). Subsequently, a gold plating is given with the substrate
181
as its common electrode to fill the holes
183
and concavities
184
with a conductive member
185
such as gold or the like as well as to raise it on the surface of the photosensitive resin film
182
to a predetermined height for the formation of bumps (FIG.
18
E). Lastly, the metallic sheet
181
is removed by etching to produce the electrical connecting member
1
which is constructed to hold the conductive member
1
which is constructed to hold the conductive member
185
with the photosensitive resin film
182
as its holding member (FIG.
18
F).
In this respect, the dimension of each part of the electrical connecting member
1
is as shown in FIG.
18
F: the thickness of the photosensitive resin
182
is approximately 10 &mgr;m, the diameter of the hole
183
(the column portion of the conductive member
185
) is approximately 20 &mgr;m, the pitch is approximately 40 &mgr;m, the height of the projections of the conductive member
185
are approximately several &mgr;m each for the front and rear.
In the electrical connecting member
1
thus manufactured, gold
185
constitutes the conductive member while the photosensitive region
182
constitutes the holding member. The conductive member comprises the portion
185
a
(hereinafter referred to as column portion
185
a
) and the portion
185
b
projecting from both faces of the holding member
182
(the end portion of the conductive member in
FIG. 18
, hereinafter referred to as bump portion
185
b
). Here, the dimension of each of the electrical connecting member
1
is that the thickness of the holding member
182
(photosensitive resin) is approximately 10 &mgr;m; the diameter of the conductive member
185
(column portion
185
a
), approximately 15 &mgr;m; pitch, approximately 40 &mgr;m; and the projecting amount of the conductive member
185
, several &mgr;m each for the front and rear.
FIG. 19
illustrates the connecting embodiment of the electric circuit components by this electrical connecting member
1
. In
FIG. 19
, reference numerals
194
and
195
designate the ob
Ikegami Yuichi
Kondo Hiroshi
Kondo Kazuo
Miyazaki Toyohide
Nakatsuka Yasuo
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