Metal fusion bonding – Process – Plural joints
Patent
1993-04-27
1994-05-03
Heinrich, Samuel M.
Metal fusion bonding
Process
Plural joints
228246, 228254, 427123, 4273837, H01L 2158, B23K 3102
Patent
active
053079833
ABSTRACT:
The present invention is embodied in a technique for precise and accurate height control in fabricating solder bumps or joints formed from a solder bump or bumps. A solder bump is formed by reflow of a conical solder body having base diameter D, height H and cone angle .theta., and has truncated sphere shape, with height h and truncation diameter d. We have found that D, H, and d can be selected such that .differential.h/.differential.H is small (typically .ltoreq.0.5), indicative of relative insensitivity of the bump height to variation in the height of the conical solder body. The inventive process is also applicable to a component (e.g., a laser) solder-bonded to a substrate, and can provide previously unattainable control of the spacing between component and substrate.
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Dudderar Thomas D.
Wong Chee C.
AT&T Bell Laboratories
Ferguson Eileen D.
Heinrich Samuel M.
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