Method of making an air tight cavity in an assembly package

Details Method of making an air tight cavity in an assembly package Method of making an air tight cavity in an assembly package

1996-02-20

1998-09-01

Chaudhuri, Olik

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Insulative housing or support

438118, 438126, 438121, H01L 2160

Patent

active

058010742

ABSTRACT:
A method of making an assembly package having an airtight cavity for housing an electrical element, such as a semiconductor chip. The method includes bonding a shell to a conductive base with a thermally setting alpha-staged epoxy resin which is characterized as being a gel in the uncured state at room temperature. The use of the alpha-staged epoxy resin, in contrast with the conventional beta-staged epoxy resin, results in an airtight cavity being formed without punctures or fissures in the epoxy resin. The method also provides a two-step heating process whereby the epoxy resin is cured at a first elevated temperature in the open atmosphere and further cured and stabilized at a second elevated temperature in a closed environment.

REFERENCES:
patent: 3602985 (1971-09-01), Nosch
patent: 3844822 (1974-10-01), Boss et al.
patent: 3962520 (1976-06-01), Watanabe et al.
patent: 4004151 (1977-01-01), Novak
patent: 4139726 (1979-02-01), Penrod et al.
patent: 4312116 (1982-01-01), Moser et al.
patent: 4410905 (1983-10-01), Grabbe
patent: 4939316 (1990-07-01), Mahulikar et al.
patent: 5059558 (1991-10-01), Tatsanakit et al.
patent: 5073521 (1991-12-01), Braden
patent: 5465481 (1995-11-01), Romero
patent: 5529959 (1996-06-01), Yamanaka
patent: 5561085 (1996-10-01), Gorowitz et al.

Affiliated with

Also associated with

Rating

Method of making an air tight cavity in an assembly package does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of making an air tight cavity in an assembly package, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of making an air tight cavity in an assembly package will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-269776