Method of making a VCSEL with passivation

Semiconductor device manufacturing: process – Making device or circuit emissive of nonelectrical signal – Including integrally formed optical element

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438 38, 438 41, H01L 2120

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active

056610750

ABSTRACT:
A substrate (103) having a first stack of DBRs (106), an active region (118), and a second stack of DBRs (138) is provided. An etch mask (146) is formed on the second stack of DBRs (138) and etched. The second stack of DBRs (138), the active region (118), and a portion of the first stack of DBRs (106) are subsequently etched. A portion of the etch mask (146) is removed from the etch mask (146). A material layer (202, 302) is then selectively deposited on portions of the second stack of DBRs (138), the active region (118), and the first stack of DBRs (106) by either selective epitaxial over-growth or mass-transfer processes, thereby passivating the VCSEL (101).

REFERENCES:
patent: 5314838 (1994-05-01), Cho et al.
patent: 5316968 (1994-05-01), Choquette
patent: 5348912 (1994-09-01), Choquette et al.
patent: 5468656 (1995-11-01), Sheith et al.
patent: 5478774 (1995-12-01), Ackley et al.
patent: 5482891 (1996-01-01), Shieh et al.

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