Metal working – Method of mechanical manufacture – Electrical device making
Patent
1991-03-18
1993-06-15
Silbaugh, Jan H.
Metal working
Method of mechanical manufacture
Electrical device making
29841, 29843, 26427215, 26427217, 156246, 156247, B29C 4514, H05K 328, H05K 334
Patent
active
052187594
ABSTRACT:
A method of making a pad array chip carrier package is disclosed. A semiconductor device (10) is bonded to a ceramic substrate (12). The semiconductor device may be attached to the substrate by wirebonding, tab bonding or flip chip bonding. The bonded assembly (16) is then attached to a flexible temporary support substrate (18) by means of an adhesive (19). The entire assembly is then placed into a mold cavity (20 and 22) and registered against the temporary support substrate (18). Plastic material (30) is molded about the semiconductor device and associated wirebonds in order to encapsulate the device. After removal from the mold, the encapsulated assembly is removed from the temporary support substrate (18) by peeling the temporary support substrate (18) from the circuit substrate.
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Bernardoni Lonnie L.
Freyman Bruce J.
Juskey Frank J.
Suppelsa Anthony B.
Dorinski Dale W.
Motorola Inc.
Ortiz Angela
Silbaugh Jan H.
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