Method of making a three-dimensional integrated circuit

Details Method of making a three-dimensional integrated circuit Method of making a three-dimensional integrated circuit

1995-09-22

1999-03-02

Chaudhari, Chandra

Semiconductor device manufacturing: process

With measuring or testing

Packaging or treatment of packaged semiconductor

438459, 438464, H01L 2166

Patent

active

058770348

ABSTRACT:
A method of making a three-dimensional integrated circuit by transferring fully processed devices from a device layer of first substrate to an auxiliary substrate, separating the auxiliary substrate and the devices thereon into individual chips, testing the chips for their functionality and mounting functioning chips on a carrier substrate in a side-by-side arrangement to form a device layer therein and thereafter mounting a further device layer on said device layer of said carrier substrate. Electrical inter-connection are formed between the devices of said to layers through passage ways in their respective substrates.

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