Method of making a thin film integrated microcircuit

Details Method of making a thin film integrated microcircuit Method of making a thin film integrated microcircuit

1987-12-28

1989-01-17

Echols, P. W.

Metal working

Method of mechanical manufacture

Electrical device making

333 11, 156 89, H01P 1100

Patent

active

047979925

ABSTRACT:
A method of forming a microwave integrated circuit is disclosed. A hole is bored in an alumina substrate and a plug having a diameter substantially equal to the hole is provided. The hole and the perimeter of the plug are coated with a thermally fusable dielectric composition and the plug is embedded in the hole. Heating the substrate fuses the plug is place and crystalizes the composition into a glass with compatible thermal expansion. At least one face of the substrate and plug are then polished to provide a planar surface. The metalized circuit is then formed on this assembly, which minimizes conductive tracking on the substrate and facilitates alignment of the circuit with the plug.

REFERENCES:
patent: 3456213 (1969-07-01), Hershenov
patent: 3480836 (1969-11-01), Aronstein
patent: 4356047 (1982-10-01), Gordon et al.
patent: 4415871 (1983-11-01), Stern et al.
patent: 4529459 (1985-06-01), Ebata et al.
patent: 4678683 (1987-07-01), Pasco et al.
patent: 4681656 (1987-07-01), Byrum
patent: 4704588 (1987-11-01), Kane
patent: 4740762 (1988-04-01), Powers et al.

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