Method of making a thick film pressure sensor

Metal working – Method of mechanical manufacture – Electrical device making

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

296211, 73727, 338 42, G01R 300, G01L 906

Patent

active

058678867

ABSTRACT:
A media-compatible, high-pressure transducer cell (12), a rugged sensor assembly (10) incorporating the cell (12), and a method for its production. The pressure cell (12) generally includes a metal body having a diaphragm (26), at least one dielectric layer (28, 38) on the diaphragm (26), and at least one thick-film piezoresistive element (34) on the dielectric layer (28, 38) for sensing deflection of the diaphragm (26). For purposes of compatibility with a wide variety of media, the metal body is preferably formed of steel, most preferably a stainless steel alloy such as an AISI Type 300 or 400 Series. The diaphragm (26) can be formed by etching or machining the metal body. The dielectric layers (28, 38) are preferably formed by thick-film processing as done for the piezoresistive element (34), employing materials that will adhere to the metal diaphragm (26), withstand the strains induced as the diaphragm (26) deflects, and faithfully transmit such strains to the thick-film piezoresistor (34).

REFERENCES:
patent: 4586018 (1986-04-01), Bettman
patent: 4657775 (1987-04-01), Shioiri et al.
patent: 4667518 (1987-05-01), Iden
patent: 4809555 (1989-03-01), Kunz
patent: 4965777 (1990-10-01), Timossi et al.
patent: 4966039 (1990-10-01), Dell'Acqua
patent: 4982351 (1991-01-01), Kawate et al.
White, An Assessment of Thick-Film Piezoresistors on Insulated Steel Substrates, Hybrid Circuits, No. 20, (Sep. 1989), pp. 23-27.
Electro-Science Laboratories, Inc., Application Notes for Thick Film Heaters made from Dielectric Tape Bonded Stainless Steel Substrates, (1994). No Month.
Stein et al., Thick Film Heaters made from Dielectric Tape Bonded Stainless Steel Substrates, ISHM '95 Proceedings, Boston MA (1994), pp. 125-129. No Month.
Wahlers et al., Dielectric Tape Bonded Stainless Steel Substrates for High Power Packages, Hybrid Circuitry and Heater Uses, (1994). No Month.
Chitale et al., High Gauge Factor Thick Film Resistors for Strain Gauges, Hybrid Circuit Technology, (May 1989).
Chitale et al., Piezoresistivity in High GF Thick Film Resistors: Sensor Design and Very Thin YSZ Substrates, Proceedings 7th IM Conference, Yokohama, Japan (Jun. 1992). pp. 561-570.
Moriwaki et al., Interactions Between Thick Film Resistors and Alumina Substrates, Proceedings 7th IM Conference, Yokohama, Japan (Jun. 1992).
Prabhu et al., Interactions Between Base Metal Thick Film Inks and High Temperature Porcelain-Coated Steel Substrates, ISHM Symposium, Chicago IL (Oct. 1994), pp. 331-340.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method of making a thick film pressure sensor does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of making a thick film pressure sensor, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of making a thick film pressure sensor will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1942401

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.