Method of making a thermally isolated via structure

Details Method of making a thermally isolated via structure Method of making a thermally isolated via structure

2007-03-05

2009-11-17

Phan, Thiem (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S825000, C029S829000, C029S846000, C029S874000, C174S260000, C174S266000, C257S522000, C257S758000, C257SE21581, C257SE23020

Reexamination Certificate

active

07617598

ABSTRACT:
This document discusses, among other things, a method including providing a laminate having a first conductive layer, a second conductive layer and an insulator between the first and second conductive layers. A hollow conductive via is formed through the insulator, the conductive via electrically connects the first and second conductive layers. At least one conductive trace electrically connects the hollow conductive via to at least one of the first and second conductive layers. The method further includes forming a channel in the insulator adjacent to the hollow conductive via and the channel surrounds the via. Wherein the channel extends at least part way between the first and second conductive layers, the at least one conductive trace bridges the channel, and the via is isolated from the insulator by the surrounding channel formed adjacent to the hollow conductive via. The via is isolated to prevent separation between the hollow conductive via and at least one of the first and second conductive layers, where the insulator is in a swollen condition.

REFERENCES:
patent: 3916513 (1975-11-01), Ballard
patent: 4494083 (1985-01-01), Josefsson et al.
patent: 5218759 (1993-06-01), Juskey et al.
patent: 5576518 (1996-11-01), Shibuya et al.
patent: 6713835 (2004-03-01), Horak et al.
patent: 6856023 (2005-02-01), Muta et al.
patent: 6881994 (2005-04-01), Lee et al.
patent: 6890828 (2005-05-01), Horak et al.
patent: 7135770 (2006-11-01), Nishiyama et al.
patent: 7205486 (2007-04-01), Primavera et al.
patent: 2003/0056981 (2003-03-01), Furukuwa
patent: 2004/0176669 (2004-09-01), Colvin, Jr.
patent: 2004/0230267 (2004-11-01), Wenger
“Prosecution File History for U.S. Appl. No. 10/892,648”, 88 pgs.

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